Prof. Hubiao Huang’s Group Hosts Exchange on Semiconductor Materials and Advanced Packaging

Date: June 03, 2026

On June 3, 2026, representatives from government departments, investment institutions and semiconductor materials companies visited the School of Integrated Circuits at Southeast University and held an exchange with Prof. Hubiao Huang’s research group at ICreativeHub. The visit focused on semiconductor materials, advanced packaging, industry–university collaboration and technology transfer. The guests first toured the School of Integrated Circuits and the International Innovation Center for Micro-Nano Systems, where team members introduced the school’s research platforms, experimental facilities and interdisciplinary research environment.

After the on-site visit, the delegation moved to ICreativeHub for a focused discussion with Prof. Huang’s group. During the session, the group introduced its research directions and recent thinking on technology transfer. The presentation started from the semiconductor value chain, including chip design, manufacturing and packaging, and then discussed key material needs in advanced processes and advanced packaging, such as advanced process materials, photoresists and supporting reagents, CMP materials, packaging materials, specialty gases and wet electronic chemicals.

Participants shared their views from different perspectives. Company representatives focused on material performance, application validation, supply-chain coordination and scalable implementation. Government representatives discussed innovation resources and regional industry development, while investment institutions paid attention to technical barriers and commercialization pathways. Through this exchange, Prof. Huang’s group gained a clearer understanding of industrial needs and possible cooperation models. Looking ahead, the group will continue to focus on key challenges in semiconductor materials and advanced manufacturing, and promote further collaboration in materials research, process validation, technology transfer and industrial application.