Research Pillars

1.Semiconductor Materials for Future Integration

Research contents:

  • Low-k / Ultra-low-k Dielectrics

  • Advanced Interconnect Materials

  • Thermal Interface Materials

  • Advanced Packaging Materials

  • Materials Reliability

  • Multi-scale Modeling

2.In-Sensor, In-Memory and In-Computing Integration

Research contents:

  • Memristor

  • Neuromorphic Devices

  • Compute-in-Memory

  • In-Sensor Computing

  • AI Hardware

Advanced Packaging

  • Chiplet

  • Hybrid Bonding

  • 3D Integration

  • Glass Substrate

  • Panel-Level Packaging

Research contents:

Advanced Process

  • Patterning

  • CMP

  • Etching

  • Thin Film Technologies

3.Advanced Manufacturing and Heterogeneous Integration

Silicon Photonics Integration

  • Co-Packaged Optics

  • Optical Interconnect

  • Photonic Packaging

4.AI4Semiconductor

Research contents:

AI for Materials

  • Materials Discovery

  • Process Optimization

AI for Manufacturing

  • Virtual Metrology

  • Yield Prediction

  • Fault Detection

AI for Devices

  • Compact Modeling

  • Device Design

AI Scientist for Semiconductor

  • Autonomous Experimentation

  • Digital Twin

  • Scientific Foundation Models